Latest Headlines
-
Teledyne e2v HiRel Announces Groundbreaking GaN Load Switch
4/5/2024
Teledyne e2v HiRel Electronics proudly announces the release of the TDGM650LS60, the first product in its innovative new 650V power module family. This new module utilizes a Teledyne high voltage Gallium Nitride (GaN) transistor and integrates an isolated driver in one package.
-
Aramco And GCT Semiconductor Holding, Inc. Sign MOU To Accelerate The Development Of The 4G And 5G Ecosystem In Saudi Arabia
4/5/2024
Aramco has signed a Memorandum of Understanding (MOU) with GCT Semiconductor Holding Inc., a leading designer and supplier of advanced 5G and 4G semiconductor solutions, setting the stage for a strategic collaboration that would further develop the 4G/5G ecosystem in Saudi Arabia for both mission-critical and public safety networks.
-
Fonon Highlights BlackStar Wafer Dicing Machine For Semiconductor Industry Applications
3/29/2024
Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive manufacturing, highlights its BlackStar Wafer Dicing Machine for applications in the semiconductor industry. The BlackStar is powered by Fonon’s patented Fantom Width Laser Dicing technology (FWLD), an innovative next-generation method of splitting brittle materials in a cost-effective way that involves no material loss.
-
Seoul Semiconductor Integrates WICOP Technology Into The Headlights Of The 2024 Genesis GV80, A Cutting-Edge Headlight Trend
3/28/2024
Seoul Semiconductor Co., Ltd., the world best-in-class technology in opto-semiconductors, is supplying and mass-producing “WICOP,” the world’s first high-power LEDs without wire, for the headlamps of Genesis GV80, a luxury SUV model by Hyundai Motor Group, which is one of the world’s top three automobile companies. The technology applies to all functions of the high-light, sophisticated headlamps introduced by GV80.
-
Semtech Elevates Global IoT Connectivity With HL78 Modules Enhanced By NTN Capabilities
3/27/2024
Semtech Corporation, a high-performance semiconductor, IoT systems, and connectivity service provider, today announced the integration of Non-Terrestrial Network (NTN) support into its HL series LPWA modules, specifically the HL7810 and HL7812. This significant advancement showcases a major leap forward in enabling uninterrupted global connectivity even amidst the most challenging conditions.
-
DNP Accelerates Development Of Photomask Manufacturing Process For 2nm Generation EUV Lithography
3/26/2024
Dai Nippon Printing Co., Ltd. has begun development of a photomask manufacturing for 2-nanometer (10-9 meter) generation logic semiconductors that support Extreme Ultra-Violet (EUV) lithography, the cutting-edge process for semiconductor manufacturing.
-
Cleanroom Film & Bags Announces CFB CleanTronics Advanced Packaging For Semiconductors And Microelectronics
3/26/2024
Cleanroom Film and Bags (CFB), a division of C-P Flexible Packaging, has expanded its line of CFB CleanTronics Advanced Packaging for semiconductors, silicon wafers, microchips, printed circuit boards, motherboards, integrated circuits, microprocessors, fiber optics and other sensitive electronic components.
-
NTT Research PHI Lab Scientists Achieve Quantum Control Of Excitons In 2D Semiconductors
3/26/2024
NTT Research, Inc., a division of NTT, today announced that scientists from its Physics & Informatics (PHI) Lab have achieved quantum control of exciton wavefunctions in two-dimensional (2D) semiconductors.
-
Renesas Introduces Industry’s First General-Purpose 32-Bit RISC-V MCUs With Internally Developed CPU Core
3/26/2024
Renesas Electronics Corporation , a premier supplier of advanced semiconductor solutions, today announced the industry’s first general-purpose 32-bit RISC-V-based microcontrollers (MCUs) built with an internally developed CPU core. While many MCU providers have recently joined investment alliances to advance the development of RISC-V products, Renesas has already designed and tested a new RISC-V core independently, which is now implemented in a commercial product and available globally.
-
Alpha And Omega Semiconductor Announces XSPairFET Buck-Boost MOSFET For Higher Power USB PD 3.1 EPR Applications
3/26/2024
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today announced its AONZ66412 XSPairFET MOSFET designed for Buck-Boost converters in USB PD 3.1 Extended Power Range (EPR) applications.