Wafer Inspection System
Source: August Technology
The NSX-95 and NSX B-95 wafer inspection systems are additions to the NSX Series and provide high-speed wafer, die and bump inspection for defects down to 0.5 micron (micro defect inspection)
August TechnologySX-95 and NSX B-95 wafer inspection systems are additions to the NSX Series and provide high-speed wafer, die and bump inspection for defects down to 0.5 micron (micro defect inspection).
The series of automated 100% micro defect inspection systems is highly flexible and gives chipmakers the capability to solve a broad range of inspection challenges throughout the semiconductor manufacturing process.
The NSX-95 for wafer and die inspection and the NSX B-95 for bump inspection are systems built on the NSX Series platform. As a result of enhanced inspection cameras, optics and illumination features, the NSX-95 and the NSX B-95 are capable of inspecting up to 63 eight-inch wafers per hour.
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