Product/Service

Spin-Processor for 4-6in Wafer Fabrication

Source: SEZ America, Inc.
The Spin-Processor 102 is designed for 4-6 inch chip fabrication and adapts 200 and 300 mm equipment design for 4, 5 and 6 inch wafer diameters
SEZ America, Inc.pin-Processor 102 is designed for 4-6 inch chip fabrication and adapts 200 and 300 mm equipment design for 4, 5 and 6 inch wafer diameters.

The spin-processor is a single-task, multi level wet processing machine with fully automatic cassette-to-cassette handling. The system includes a Chemical Dispense System to provide up to three chemicals at the required quantity and temperature. Additional features of the Spin-Processor are an integrated controller, integrated suck back box, flipmodule, uses through beam sensors and is GEM compatible, The tool requires no flat-alignment and offers frontside and backside processing with no equipment changes needed.

The main applications are backside film removal and cleaning, stress relief and wafer thinning of silicon, GaAs or other compound material wafers, wafer reclaim, post-etch polymer removal and oxide etching.

<%=company%>, 4824 S. 40th Street, Phoenix, AZ 850404, Tel: 602-437-5050, Fax: 602-437-4949