Single Wafer Etch Systems Achieve 1% Uniformity

Source: Solid State Equipment Corporation
Trilennium™ 3300 systems provide a single wafer wet etch process that routinely achieves 1% uniformity. In addition to superior uniformity, lower cost of ownership is achieved through reduced chemical consumption, less floor space, and lower capital costs than alternative batch methods. Multiple chamber systems are available, letting you scale a system to match your production requirements. Single wafer systems allow wafers to be processed on demand. The process is completely digitized including temperature, flows, pressures, and other process parameters. Single or multiple sequential wet etching is available with single pass or recirculated chemistry. A convenient Windows® user interface is provided with GEM SECS II software. All Systems are SEMI® S2-0200 compliant and CE Marked.

Solid State Equipment Corporation manufactures a full line of single wafer cleaners/processors and hermetic package sealers at its headquarters in suburban Philadelphia. These systems are complemented with application-specific components and supporting systems, including chemistry management systems and environmental systems for sealers. SSEC maintains sales and service offices worldwide, and customer support and process development centers in Horsham, Pennsylvania, Fremont, California, Regensburg, Germany, and Tokyo, Japan. For further information, contact Terri Kolodziejski at SSEC, 215-328-0700, FAX 215-328-9410, tkolodziejski@ssecusa.com.

Solid State Equipment Corporation, 185 Gibraltar Road, Horsham, PA 19044. Tel: 215-328-0700; Fax: 215-328-9410.