Plasma System 400

TePla- Microwave PLASMA Cleaning in Chip Assembly
The advanced solution for optimum mold adhesion and excellent wire bonding and lead bonding.

• Chip Scale Packages
• Multi Chip Modules
• Chip on Board
• Plastic Ball Grid Arrays
• Quad Flat Packages

The only plasma equipment for processing unslotted magazines

Applications

• Precision cleaning and activation of leadframes and PBGA's prior to molding, die bond and wire bond
• Precision cleaning of metals, glass, ceramic.
• Removal of organic residues or films
• Junction separation (dry etching) in solar cell production
• Surface activation of plastics

Microwave Plasma Excellence

• Unslotted and slotted magazines processable
• Any size of magazines
• Most efficient plasma discharge, fast and uniform processing
• No damage of electronic components
• Electrodeless plasma generation
• Industry qualified

Tepla Inc. , 1321 Valwood Parkway, Suite 400, Carrollton, TX 75006. Tel: 972-247-0053; Fax: 972-247-0405.