Product/Service

Dielectric Etch eMax Centura

Source: Applied Materials, Inc.
Dielectric Etch eMax Centura is a system for etching advanced chip structures with geometries at 0.13 micron and beyond
Applied Materials, Inc.Etch eMax Centura is a system for etching advanced chip structures with geometries at 0.13 micron and beyond. The eMax system features medium-density plasma source technology, a new chamber design and innovative process chemistry to maximize etching performance and productivity while reducing system operating cost.

The Applied Materials, Inc.Etch eMax Centura system is targeted for etch applications, including self-aligned, high aspect ratio and logic contacts, as well as dual damascene and low k Applied Materials, Inc.films.

The eMax chambers are available on Applied Materials' enhanced Etch Centura II multi-chamber platform, which features a dual blade robotic handling system for increased throughput. The eMax Centura II can be configured with up to four process chambers, allowing a significant operational cost advantage over more limited capacity three-chamber systems. eMax chambers also can be added to existing Centura and Centura II platforms.

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